ICROS™ Tape

High-clean adhesive tape

Usage detail

Ultra clean, protective tape for silicon wafer back-grinding process in semiconductor manufacturing.

Usage
Characteristic
  • Introduction
  • Variation
  • Manufacturing

ICROS™ TAPE is a surface protective tape used in silicon wafer back-grinding process for the manufacturer of integrated circuits.

ICROS™ Tape Outstanding Features

  • Super softness
  • No contamination
  • Uniform thickness

Patents

  • Two US patents (4853286 & 4928438)
  • Japan Patent (1563284)
  • Korea Patent (34757)
  • Mitsui Chemicals offers solutions for every backgrinding application:
  • Conventional Tapes
    Non-UV
    UV
  • Bumped Wafer Tapes
    Gold bump (20-30um bump height)
    Pillar Bump (40-100um bump height)
    Solder Bump (100-150um bump height)
    Solder bump (150um+ bump height)
  • Thin Grinding Tapes
  • Chemical Resistant / Heat Resistant Tape

No Rinse Process- For Thin Wafer Grinding

ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage

NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]

The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.

ICROS™ Conventional Tapes (Non-UV and UV Types)

Conventional Tapes - Non-UV Type

The non-UV conventional type of the ICROS™ backgrinding wafer tape line features little to no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.

  • Superior TTV
  • Soft & Hard Type
  • Multiple thickness types
  • No residue after removal
  • Low ionic impurities
  • Easy detaping
  • Many adhesive types and strengths

Conventional Tapes - UV Type

The UV tape of the ICROS backgrinding wafer tape line features high adhesive strength, no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.

  • Superior TTV
  • No residue after removal
  • Low ionic impurities
  • Easy detaping
  • High adhesion strength

ICROS™ Bumped Wafer Tapes

Gold Bumped Wafer Tape for 20-30um Bump Height

The ICROS™ bumped wafer tape is the best solution for gold bumped wafers. The ICROS™ bumped wafer tape features a soft adhesive for good bump absorption to prevent water penetration and wafer breakage.

  • Superior TTV
  • Soft adhesive provides for good bump absorption
  • High cohesive strength and high molecular weight will result in no residue after removal
  • Low ionic impurities

Pillar Bumped Wafer Tape for 40-100um Bump Height

The ICROS bumped wafer tape is the best solution for medium bump such as Pb and Cu pillar bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

  • Superior TTV
  • Soft intermediate layer provides for good bump absorption
  • No residue after removal
  • Low ionic impurities
  • UV type adhesive available

Solder Bumped Wafer Tape for 100-150um Bump Height

The ICROS™ bumped wafer tape is the best solution for high bumped wafers such as solder bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

  • Superior TTV
  • Soft intermediate layer provides for good bump absorption
  • Low ionic impurities
  • Low adhesive strength after UV irradiation makes detaping easy

Solder Bumped Wafer Tape for 150+um Bump Height

The ICROS™ bumped wafer tape is the best solution for super high bumped wafers such as solder bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

  • Superior TTV
  • Special resin layer transforms to bump shape providing good bump absorption
  • Low ionic impurities
  • Both Non-UV and UV types adhesive available

ICROS™ Thin Grinding Tapes

The ICROS™ thin wafer backgrinding tape line features special anti-warpage properties that significantly flattens the wafer. This tape has a warpage of 2mm versus 26mm for conventional tape which reduces risk of wafer breakage during handling and transportation. In addition, the super clean adhesive is designed to eliminate the rinse process.

  • Superior TTV
  • Hard type base film to support extra thin wafers
  • Anti-warpage properties
  • No residue after removal
  • High temperature capable
  • Easy detaping
  • Low Taping Tension to Reduce Wafer Warpage
    → 'New Easy Peel-off Liner' PB type

Anti-warpage

Mechanism

Proposal (De-taping Process)

ICROS™ Chemical Resistant / Heat Resistant Tape

The ICROS™ chemical/heat resistant backgrinding tape has superior durability for etching and high temperature processes.

  • Acid resistant
  • No Deformation
  • Hardness for wafer support
  • High adhesion
  • No residue after removal
  • Low adhesive strength increase with heat

The cleanest tape in the industry gets a new factory.

The new facility translates into immediate and tangible benefits including:

  • Advanced production
  • Improved tape TTV
  • Longer shelf life
  • Cleanest tape in the industry
    • Exclusive for ICROS TAPE™ means no cross contamination
  • Fast lead times

Advanced Production

Through the production process, Mitsui Chemicals adheres to a strict QC System eliminating foreign matter and defects producing high performance solutions. All components are produced at the facility.

Customer Solution Development

ICROS tape offers high performance solutions for your process.  Our experienced professionals will conduct a needs analysis to determine the tape that best fits your application.

ICROS™ Tape offers high performance solutions for your process. Contact us and we will recommend the best, suitable tape for your process.

Contact Us

MITSUI CHEMICALS AMERICA, INC.
TEL+1 914-253-0777
FAX+1 914-253-0790